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Intelligent Optical Inspection Innovative Practice Packaging & Testing Wire Bonding Machine Light Source Detection Solutions

Challenges

The precision of wire bonding machine used to package and test wafers significantly affects IC yield ratio. Whether or not precision is achieved depends on the CCD of the wire bonding machine. The quality of image extracted by CCD depends on the light source's degree of stability and illuminance. Generally, most wire bonding machines apply a specific wavelength colored light as the light source for CCD images. Specific-wavelength light source and wire bonding machine's structural limitations, means that highly customized solutions are required for the measuring of light sources.

Solutions

Apacer's Wire bonding machine CCD illuminance measurement scheme adopts spectral illumination meter and thin appearance design, which exceed the structural limitations of wire bonding machine, and satisfy light source correction testing demands.

Stabilize the IC encapsulation production quality.

Maintain the CCD light source quality and guarantee the stable capacity and quality.

Features

Longitude & Latitude calibration

Pioneering Longitude & Latitude calibration, precise position measurements

Corresponding software & hardware

User-friendly software, easy establishment of measurement standards

Specified customization

Customized cover, applicable to devices of different brands

Supports different light sources

High-end algorithms, convenient calibration of different light sources

File management

Simplified saving, benefitting data management

outcome

Apacer's wire bonding machine CCD Luminance Measuring solution can exceed wire bonding machine's structural limitations. The spectral-type luminance meter has adopted thin appearance design to achieve optimal light source calibration effect.

Corresponding Product